ZutaCore Closes $100M Funding Round to Cool the Next Generation of AI Data Centres
ZutaCore, which makes waterless two-phase liquid cooling systems for AI and high-performance computing infrastructure, has closed a $100 million Series C round backed by Mitsubishi Electric, Carrier Ventures, and Samsung Ventures. The funding will support global commercialisation and R&D into thermal management for next-generation chip architectures, with ZutaCore’s platform already designed to handle processors exceeding […]